| Method for modifying or verifying a circuit by inserting a saboteur circuit |
US12210427B1 |
01/28/2025
|
| Self-insulating metal vias in magnetic micro-devices |
US12094629B1 |
09/17/2024
|
| Heterogeneous radiation-hardened computing system |
US12079159B1 |
09/03/2024
|
| CMOS compatible low-resistivity Al—Sc metal etch stop |
US12034050B1 |
07/09/2024
|
| High aspect ratio gratings fabricated by electrodeposition |
US11798844B1 |
10/24/2023
|
| Method of chemical doping that uses CMOS-compatible processes |
US11798808B1 |
10/24/2023
|
| Miniaturized vacuum package and methods of making same |
US11551921B1 |
01/10/2023
|
| Enhanced microfabrication using electrochemical techniques |
US11549903B1 |
01/10/2023
|
| Metal stack templates for suppressing secondary grains in sca1n |
US11482660B1 |
10/25/2022
|
| Photolithography of atomic layer resist |
US11424135B1 |
08/23/2022
|
| Tunneling full-wave infrared rectenna |
US11296240B1 |
04/05/2022
|
| Apparatus and method to measure semiconductor optical absorption using microwave charge sensing |
US11125700B2 |
09/21/2021
|
| ScAIN etch mask for highly selective etching |
US10651048B1 |
05/12/2020
|
| ScAIN etch mask for highly selective etching |
US10651048B1 |
05/12/2020
|
| ScAIN etch mask for highly selective etching |
US10651048B1 |
05/12/2020
|
| Regrowth method for fabricating wide-bandgap transistors, and devices made thereby |
US10553697B1 |
02/04/2020
|
| Regrowth method for fabricating wide-bandgap transistors, and devices made thereby |
US10553697B1 |
02/04/2020
|
| Regrowth method for fabricating wide-bandgap transistors, and devices made thereby |
US10553697B1 |
02/04/2020
|
| Systems and methods for interferometric end point detection for a focused ion beam fabrication tool |
US10446369B1 |
10/15/2019
|
| Systems and methods for interferometric end point detection for a focused ion beam fabrication tool |
US10446369B1 |
10/15/2019
|
| Systems and methods for interferometric end point detection for a focused ion beam fabrication tool |
US10446369B1 |
10/15/2019
|
| Regrowth method for fabricating wide-bandgap transistors, and devices made thereby |
US10388753B1 |
08/20/2019
|
| Regrowth method for fabricating wide-bandgap transistors, and devices made thereby |
US10388753B1 |
08/20/2019
|
| Bus based timed input output module |
US10289573B1 |
05/14/2019
|
| Bus based timed input output module |
US10289573B1 |
05/14/2019
|
| Via configuration for wafer-to-wafer interconnection |
US10224312B1 |
03/05/2019
|
| Via configuration for wafer-to-wafer interconnection |
US10224312B1 |
03/05/2019
|
| Passive radiative cooling of a body |
US10173792B1 |
01/08/2019
|
| Passive radiative cooling of a body |
US10173792B1 |
01/08/2019
|
| Graphene heat dissipating structure |
US10096536B1 |
10/09/2018
|
| Graphene heat dissipating structure |
US10096536B1 |
10/09/2018
|
| System on chip module configured for event-driven architecture |
US10089160B2 |
10/02/2018
|
| System on chip module configured for event-driven architecture |
US10089160B2 |
10/02/2018
|
| Method and apparatus of enhanced thermoelectric cooling and power conversion |
US10072879B1 |
09/11/2018
|
| Method and apparatus of enhanced thermoelectric cooling and power conversion |
US10072879B1 |
09/11/2018
|
| Flexible packaging for microelectronic devices |
US9978895B2 |
05/22/2018
|
| Flexible packaging for microelectronic devices |
US9978895B2 |
05/22/2018
|
| Packaging system with cleaning channel and method of making the same |
US9972553B1 |
05/15/2018
|
| Packaging system with cleaning channel and method of making the same |
US9972553B1 |
05/15/2018
|
| Gallium beam lithography for superconductive structure formation |
US9882113B1 |
01/30/2018
|
| Gallium beam lithography for superconductive structure formation |
US9882113B1 |
01/30/2018
|
| Method of making thermally-isolated silicon-based integrated circuits |
US9824932B1 |
11/21/2017
|
| System on chip module configured for event-driven architecture |
US9792250B1 |
10/17/2017
|
| Processing device with self-scrubbing logic |
US9792184B2 |
10/17/2017
|
| Apparatus for assembly of microelectronic devices |
US9763370B2 |
09/12/2017
|
| Graphene heat dissipating structure |
US9721867B1 |
08/01/2017
|
| Method of making a silicon nanowire device |
US9660026B1 |
05/23/2017
|
| Wafer scale oblique angle plasma etching |
US9659797B1 |
05/23/2017
|
| Thermally-isolated silicon-based integrated circuits and related methods |
US9646874B1 |
05/09/2017
|
| Visible light laser voltage probing on thinned substrates |
US9599667B1 |
03/21/2017
|
| Photoelectrochemically driven self-assembly method |
US9548411B2 |
01/17/2017
|
| Methods of depositing an alpha-silicon-carbide-containing film at low temperature |
US9546420B1 |
01/17/2017
|
| Silicon nanowire device and method for its manufacture |
US9536947B1 |
01/03/2017
|
| Transparent contacts for stacked compound photovoltaic cells |
US9508881B2 |
11/29/2016
|
| Methods for dry etching semiconductor devices |
US9484216B1 |
11/01/2016
|
| Fabrication method for small-scale structures with non-planar features |
US9448336B1 |
09/20/2016
|
| Integrated circuit test-port architecture and method and apparatus of test-port generation |
US9311444B1 |
04/12/2016
|
| Processing device with self-scrubbing logic |
US9274895B1 |
03/01/2016
|
| Tuning method for microresonators and microresonators made thereby |
US9203134B1 |
12/01/2015
|
| Fabrication of small-scale structures with non-planar features |
US9190736B1 |
11/17/2015
|
| Three-dimensional stacked structured ASIC devices and methods of fabrication thereof |
US9190392B1 |
11/17/2015
|
| Separating semiconductor devices from substrate by etching graded composition release layer disposed between semiconductor devices and substrate including forming protuberances that reduce stiction |
US9029239B2 |
05/12/2015
|
| Protecting integrated circuits from excessive charge accumulation during plasma cleaning of multichip modules |
US9013046B1 |
04/21/2015
|
| Membrane projection lithography |
US8981337B1 |
03/17/2015
|
| Processes for multi-layer devices utilizing layer transfer |
US8946052B2 |
02/03/2015
|
| Method of forming through substrate vias (TSVs) and singulating and releasing die having the TSVs from a mechanical support substrate |
US8906803B2 |
12/09/2014
|
| Structured wafer for device processing |
US8895364B1 |
11/25/2014
|
| Full tape thickness feature conductors for EMI structures |
US8747591B1 |
06/10/2014
|
| Structured wafer for device processing |
US8729673B1 |
05/20/2014
|
| Die singulation method |
US8623744B1 |
01/07/2014
|
| Method for forming precision clockplate with pivot pins |
US7728248B1 |
06/01/2010
|
| Redox buffered hydrofluoric acid etchant for the reduction of galvanic attack during release etching of MEMS devices having noble material films |
US7597819B1 |
10/06/2009
|
| Apparatus for raising or tilting a micromechanical structure |
US7421924B1 |
09/09/2008
|
| Laser-based irradiation apparatus and method to measure the functional dose-rate response of semiconductor devices |
US7375332B1 |
05/20/2008
|