| Abstract: | A device may be provided in a sealed package by aligning a seal ring
provided on a first surface of a first semiconductor wafer in opposing
relationship with a seal ring that is provided on a second surface of a
second semiconductor wafer and surrounds a portion of the second wafer
that contains the device. Forcible movement of the first and second wafer
surfaces toward one another compresses the first and second seal rings
against one another. A physical barrier against the movement, other than
the first and second seal rings, is provided between the first and second
wafer surfaces. |