Protecting integrated circuits from excessive charge accumulation during plasma cleaning of multichip modules

Patent Number: 9,013,046
Issued: 4/21/2015
Official Filing: View the Complete Patent
Abstract: Internal nodes of a constituent integrated circuit (IC) package of a multichip module (MCM) are protected from excessive charge during plasma cleaning of the MCM. The protected nodes are coupled to an internal common node of the IC package by respectively associated discharge paths. The common node is connected to a bond pad of the IC package. During MCM assembly, and before plasma cleaning, this bond pad receives a wire bond to a ground bond pad on the MCM substrate.
Filed: 7/18/2013
Application Number: 13/945,074
Government Interests: STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention.