MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads
| Patent Number: | 8,597,985 |
| Issued: | 12/3/2013 |
| Official Filing: | View the Complete Patent |
| Abstract: | In wafer-level packaging of microelectromechanical (MEMS) devices a lid wafer is bonded to a MEMS wafer in a predetermined aligned relationship. Portions of the lid wafer are removed to separate the lid wafer into lid portions that respectively correspond in alignment with MEMS devices on the MEMS wafer, and to expose areas of the MEMS wafer that respectively contain sets of bond pads respectively coupled to the MEMS devices. |
| Filed: | 2/1/2012 |
| Application Number: | 13/364,166 |
| Government Interests: | STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |