|Abstract: ||Various technologies presented herein relate to forming one or more heat
dissipating structures (e.g., heat spreaders and/or heat sinks) on a
substrate, wherein the substrate forms part of an electronic component.
The heat dissipating structures are formed from graphene, with advantage
being taken of the high thermal conductivity of graphene. The graphene
(e.g., in flake form) is attached to a diazonium molecule, and further,
the diazonium molecule is utilized to attach the graphene to material
forming the substrate. A surface of the substrate is treated to comprise
oxide-containing regions and also oxide-free regions having underlying
silicon exposed. The diazonium molecule attaches to the oxide-free
regions, wherein the diazonium molecule bonds (e.g., covalently) to the
exposed silicon. Attachment of the diazonium plus graphene molecule is
optionally repeated to enable formation of a heat dissipating structure
of a required height.