Full tape thickness feature conductors for EMI structures

Patent Number: 8,747,591
Issued: 6/10/2014
Official Filing: View the Complete Patent
Abstract: Generally annular full tape thickness conductors are formed in single or multiple tape layers, and then stacked to produce an annular solid conductive wall for enclosing an electromagnetic isolation cavity. The conductors may be formed using punch and fill operations, or by flowing conductor-containing material onto the tape edge surfaces that define the interior sidewalls of the cavity.
Filed: 7/9/2010
Application Number: 12/833,262
Government Interests: STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention.