MINIATURIZED VACUUM PACKAGE AND METHODS OF MAKING SAME |
11,551,921 |
01/10/2023
|
ENHANCED MICROFABRICATION USING ELECTROCHEMICAL TECHNIQUES |
11,549,903 |
01/10/2023
|
METAL STACK TEMPLATES FOR SUPPRESSING SECONDARY GRAINS IN ScAlN |
11,482,660 |
10/25/2022
|
PHOTOLITHOGRAPHY OF ATOMIC LAYER RESIST |
11,424,135 |
08/23/2022
|
TUNNELING FULL-WAVE INFRARED RECTENNA |
11,296,240 |
04/05/2022
|
Apparatus and method to measure semiconductor optical absorption using
microwave charge sensing |
11,125,700 |
09/21/2021
|
ScAIN etch mask for highly selective etching |
10,651,048 |
05/12/2020
|
Regrowth method for fabricating wide-bandgap transistors, and devices made
thereby |
10,553,697 |
02/04/2020
|
Systems and methods for interferometric end point detection for a focused
ion beam fabrication tool |
10,446,369 |
10/15/2019
|
Regrowth method for fabricating wide-bandgap transistors, and devices made
thereby |
10,388,753 |
08/20/2019
|
Bus based timed input output module |
10,289,573 |
05/14/2019
|
Via configuration for wafer-to-wafer interconnection |
10,224,312 |
03/05/2019
|
Passive radiative cooling of a body |
10,173,792 |
01/08/2019
|
Defect screening method for electronic circuits and circuit components
using power spectrum anaylysis |
10,145,894 |
12/04/2018
|
Scanning method for screening of electronic devices |
10,094,874 |
10/09/2018
|
Graphene heat dissipating structure |
10,096,536 |
10/09/2018
|
System on chip module configured for event-driven architecture |
10,089,160 |
10/02/2018
|
Method and apparatus of enhanced thermoelectric cooling and power
conversion |
10,072,879 |
09/11/2018
|
Flexible packaging for microelectronic devices |
9,978,895 |
05/22/2018
|
Packaging system with cleaning channel and method of making the same |
9,972,553 |
05/15/2018
|
Gallium beam lithography for superconductive structure formation |
9,882,113 |
01/30/2018
|
Method of making thermally-isolated silicon-based integrated circuits |
9,824,932 |
11/21/2017
|
Processing device with self-scrubbing logic |
9,792,184 |
10/17/2017
|
System on chip module configured for event-driven architecture |
9,792,250 |
10/17/2017
|
Apparatus for assembly of microelectronic devices |
9,763,370 |
09/12/2017
|
Fast process flow, on-wafer interconnection and singulation for MEPV |
9,748,415 |
08/29/2017
|
Graphene heat dissipating structure |
9,721,867 |
08/01/2017
|
Wafer scale oblique angle plasma etching |
9,659,797 |
05/23/2017
|
Method of making a silicon nanowire device |
9,660,026 |
05/23/2017
|
Thermally-isolated silicon-based integrated circuits and related methods |
9,646,874 |
05/09/2017
|
Visible light laser voltage probing on thinned substrates |
9,599,667 |
03/21/2017
|
Fast process flow, on-wafer interconnection and singulation for MEPV |
9,559,219 |
01/31/2017
|
Photoelectrochemically driven self-assembly method |
9,548,411 |
01/17/2017
|
Methods of depositing an alpha-silicon-carbide-containing film at low
temperature |
9,546,420 |
01/17/2017
|
Silicon nanowire device and method for its manufacture |
9,536,947 |
01/03/2017
|
Transparent contacts for stacked compound photovoltaic cells |
9,508,881 |
11/29/2016
|
Methods for dry etching semiconductor devices |
9,484,216 |
11/01/2016
|
Microfluidic pressure amplifier circuits and electrostatic gates for
pneumatic microsystems |
9,447,895 |
09/20/2016
|
Fabrication method for small-scale structures with non-planar features |
9,448,336 |
09/20/2016
|
Integrated circuit test-port architecture and method and apparatus of
test-port generation |
9,311,444 |
04/12/2016
|
Processing device with self-scrubbing logic |
9,274,895 |
03/01/2016
|
Tuning method for microresonators and microresonators made thereby |
9,203,134 |
12/01/2015
|
Three-dimensional stacked structured ASIC devices and methods of
fabrication thereof |
9,190,392 |
11/17/2015
|
Fabrication of small-scale structures with non-planar features |
9,190,736 |
11/17/2015
|
Power spectrum analysis for defect screening in integrated circuit devices |
9,188,622 |
11/17/2015
|
Separating semiconductor devices from substrate by etching graded
composition release layer disposed between semiconductor devices and
substrate including forming protuberances that reduce stiction |
9,029,239 |
05/12/2015
|
Protecting integrated circuits from excessive charge accumulation during
plasma cleaning of multichip modules |
9,013,046 |
04/21/2015
|
Membrane projection lithography |
8,981,337 |
03/17/2015
|
Processes for multi-layer devices utilizing layer transfer |
8,946,052 |
02/03/2015
|
Method of forming through substrate vias (TSVs) and singulating and
releasing die having the TSVs from a mechanical support substrate |
8,906,803 |
12/09/2014
|
Structured wafer for device processing |
8,895,364 |
11/25/2014
|
Full tape thickness feature conductors for EMI structures |
8,747,591 |
06/10/2014
|
Structured wafer for device processing |
8,729,673 |
05/20/2014
|
Die singulation method |
8,623,744 |
01/07/2014
|
MEMS packaging with etching and thinning of lid wafer to form lids and
expose device wafer bond pads |
8,597,985 |
12/03/2013
|
Wafer-level packaging with compression-controlled seal ring bonding |
8,575,748 |
11/05/2013
|
Method to determine the position-dependant metal correction factor for
dose-rate equivalent laser testing of semiconductor devices |
8,481,345 |
07/09/2013
|
Die singulation method |
8,461,023 |
06/11/2013
|
Die singulation method and package formed thereby |
8,236,611 |
08/07/2012
|
Micromachined cutting blade formed from {211}-oriented silicon |
7,992,309 |
08/09/2011
|
Method for the Protection of Extreme Ultraviolet Lithography Optics |
7,740,916 |
06/22/2010
|
Method for forming precision clockplate with pivot pins |
7,728,248 |
06/01/2010
|
Redox buffered hydrofluoric acid etchant for the reduction of galvanic attack during release etching of MEMS devices having noble material films |
7,597,819 |
10/06/2009
|
Adhesive particle shielding |
7,473,301 |
01/06/2009
|
Apparatus for raising or tilting a micromechanical structure |
7,421,924 |
09/09/2008
|
Laser-based irradiation apparatus and method to measure the functional dose-rate response of semiconductor devices |
7,375,332 |
05/20/2008
|
Condenser Optic with Sacrificial Reflective Surface |
7,239,443 |
07/03/2007
|
Method for forming permanent magnets with different polarities for use in microelectromechanical devices |
7,207,102 |
04/24/2007
|
Method to control artifacts of microstructural fabrication |
7,105,098 |
09/12/2006
|
Condenser optic with sacrificial reflective surface |
7,081,992 |
07/25/2006
|