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Patent • #10,054,433. A headlamp aiming tool includes a linear member and four legs. The first and second legs are used to measure the distance between the headlamps of a vehicle and the height of the headlamps relative to the ground or floor. The tool may also be mounted on the vehicle...

Patent • #8,228,675. Systems and methods for a forced-convection heat exchanger are provided. In one embodiment, heat is transferred to or from a thermal load in thermal contact with a heat conducting structure, across a narrow air gap, to a rotating heat transfer structure immersed in a surrounding medium such as air.

Patent • #8,988,881. Systems and methods for a forced-convection heat exchanger are provided. In one embodiment, heat is transferred to or from a thermal load in thermal contact with a heat conducting structure, across a narrow air gap, to a rotating heat transfer structure immersed in a surrounding medium such as air.

Patent • #9,207,023. Systems and methods for a forced-convection heat exchanger are provided. In one embodiment, heat is transferred to or from a thermal load in thermal contact with a heat conducting structure, across a narrow air gap, to a rotating heat transfer structure immersed in a surrounding medium such as air.

Patent • #10,036,581. Embodiments of the invention are directed to heat exchanger assemblies, systems, and methods for conditioning medium in an environment (e.g., in a controlled environment) to a suitable temperature. In particular, embodiments may include heat transfer assemblies and medium conditioning systems that may condition the medium in the environment by...

Patent • #10,041,701. Embodiments disclosed herein relate to devices, systems, and methods for cooling and/or heating a medium as well as cooling and/or heating an environment containing the medium. More specifically, at least one embodiment includes a heat pump that may heat and/or cool a medium and, in some instances, may transfer...

Patent • #10,876,773. Embodiments disclosed herein relate to devices, systems, and methods for cooling and/or heating a medium as well as cooling and/or heating an environment containing the medium. More specifically, at least one embodiment includes a heat pump that may heat and/or cool a medium and, in some instances, may transfer...

Patent • #10,429,105. Embodiments disclosed herein relate to devices, systems, and methods for cooling and/or heating a medium as well as cooling and/or heating an environment containing the medium. More specifically, at least one embodiment includes a heat pump that may heat and/or cool a medium and, in some instances, may transfer...

Patent • #6496301. A multi-mode gain fiber is provided which affords substantial improvements in the maximum pulse energy, peak power handling capabilities, average output power, and/or pumping efficiency of fiber amplifier and laser sources while maintaining good beam quality (comparable to that of a conventional single-mode fiber source). These benefits are realized...

Patent • #10,931,059. A hermetically-sealed edge-connect header that can withstand high temperatures, high pressures (or high vacuum levels), and high vibration environments, along with two corresponding connectors are disclosed. After brazing the edge-connect header components, the assembly is machined to form a slot with a portion of each of a plurality of...

Patent • #11,296,454. A hermetically-sealed edge-connect header that can withstand high temperatures, high pressures (or high vacuum levels), and high vibration environments, along with two corresponding connectors are disclosed. After brazing the edge-connect header components, the assembly is machined to form a slot with a portion of each of a plurality of...

Patent • #11,424,572.

Patent • #11990252. A combination of materials and processing parameters have been developed for hermetic seals for electrical feedthroughs in high performance applications. A glass-ceramic forms a hermetic seal between a stainless steel shell and a platinum-nickel-based (Pt—Ni) pin alloy for electrical feedthroughs. The glass-ceramic is processed to develop a coefficient of...

Patent • #8,482,739. A heterodyne photomixer spectrometer comprises a receiver photomixer that is driven at a different frequency than the source photomixer, thereby maintaining the coherent nature of the detection, eliminating etalon effects, and providing not only the amplitude but also the phase of the received signal. The heterodyne technique can be...

Patent • #11675126. A hybrid photonic integrated circuit and a method of its manufacture are provided. A SiP functional layer is fabricated on an SOI wafer. A lithium niobate thin film is bonded to the SiP functional layer. The silicon handle layer is removed from the SOI wafer to expose buried oxide,...

Patent • #12079159. A radiation-hardened (rad-hard) computing system can include a rad-hard processor, a second processor, and a memory operably coupled to the rad-hard processor. The rad-hard processor can cause the second processor to execute compute-intensive tasks that can be performed more quickly or with fewer computing resources by the second processor...

Patent • #11948979. An acoustoelectric amplifier and a number of corresponding devices are disclosed, along with methods for making the same. The acoustoelectric amplifier employs wafer-scale bonding to heterogeneously integrate an epitaxial III-V semiconductor stack and a piezoelectric layer. To increase the acoustic gain with low power dissipation, the electromechanical coupling coefficient...

Patent • #10,788,689. In an electro-optical modulator, an electro-optical modulation layer is bonded to a cladding layer that overlies a substrate. A modulation zone waveguide is optically coupled to the electro-optical modulation layer and optically coupled to an I/O waveguiding structure embedded in the cladding layer. The I/O waveguiding structure is conformed...

Patent • #7,335,972. A microsystem-on-a-chip comprises a bottom wafer of normal thickness and a series of thinned wafers can be stacked on the bottom wafer, glued and electrically interconnected. The interconnection layer comprises a compliant dielectric material, an interconnect structure, and can include embedded passives. The stacked wafer technology provides a heterogeneously...

Patent • #7,132,163. Heteroporphyrin nanotubes, metal nanostructures, and metal/porphyrin-nanotube composite nanostructures formed using the nanotubes as photocatalysts and structural templates, and the methods for forming the nanotubes and composites.

Patent • #7,223,474. Heteroporphyrin nanotubes, metal nanostructures, and metal/porphyrin-nanotube composite nanostructures formed using the nanotubes as photocatalysts and structural templates, and the methods for forming the nanotubes and composites.

Patent • #8,194,068. A techniques for coarsening a hexahedral mesh is described. The technique includes identifying a coarsening region within a hexahedral mesh to be coarsened. A boundary sheet of hexahedral elements is inserted into the hexahedral mesh around the coarsening region. A column of hexahedral elements is identified within the boundary...

Patent • #8,280,887. Large data sets are analyzed by hierarchical clustering using correlation as a similarity measure. This provides results that are superior to those obtained using a Euclidean distance similarity measure. A spatial continuity constraint may be applied in hierarchical clustering analysis of images.