Patent • #US10876773B2. Embodiments disclosed herein relate to devices, systems, and methods for cooling and/or heating a medium as well as cooling and/or heating an environment containing the medium. More specifically, at least one embodiment includes a heat pump that may heat and/or cool a medium and, in some instances, may transfer...
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Heating and cooling devices, systems and related method
Patent • #US10429105B1. Embodiments disclosed herein relate to devices, systems, and methods for cooling and/or heating a medium as well as cooling and/or heating an environment containing the medium. More specifically, at least one embodiment includes a heat pump that may heat and/or cool a medium and, in some instances, may transfer...
Hermetic edge-connect headers and corresponding connectors
Patent • #US10931059B1. A hermetically-sealed edge-connect header that can withstand high temperatures, high pressures (or high vacuum levels), and high vibration environments, along with two corresponding connectors are disclosed. After brazing the edge-connect header components, the assembly is machined to form a slot with a portion of each of a plurality of...
Hermetic edge-connect headers and corresponding connectors
Patent • #US11424572B2. A hermetically-sealed edge-connect header that can withstand high temperatures, high pressures (or high vacuum levels), and high vibration environments, along with two corresponding connectors are disclosed. After brazing the edge-connect header components, the assembly is machined to form a slot with a portion of each of a plurality of...
Hermetic edge-connect headers and corresponding connectors
Patent • #US11296454B2. A hermetically-sealed edge-connect header that can withstand high temperatures, high pressures (or high vacuum levels), and high vibration environments, along with two corresponding connectors are disclosed. After brazing the edge-connect header components, the assembly is machined to form a slot with a portion of each of a plurality of...
Hermetic electrical feedthrough comprising a Pt—Ni-based pin alloy
Patent • #US11990252B2. A combination of materials and processing parameters have been developed for hermetic seals for electrical feedthroughs in high performance applications. A glass-ceramic forms a hermetic seal between a stainless steel shell and a platinum-nickel-based (Pt—Ni) pin alloy for electrical feedthroughs. The glass-ceramic is processed to develop a coefficient of...
Heterodyne photomixer spectrometer with receiver photomixer driven at different frequency than source photomixer
Patent • #US8482739B1. A heterodyne photomixer spectrometer comprises a receiver photomixer that is driven at a different frequency than the source photomixer, thereby maintaining the coherent nature of the detection, eliminating etalon effects, and providing not only the amplitude but also the phase of the received signal. The heterodyne technique can be...
Heterogeneous integration of an electro-optical platform
Patent • #US11675126B1. A hybrid photonic integrated circuit and a method of its manufacture are provided. A SiP functional layer is fabricated on an SOI wafer. A lithium niobate thin film is bonded to the SiP functional layer. The silicon handle layer is removed from the SOI wafer to expose buried oxide,...
Heterogeneous radiation-hardened computing system
Patent • #US12079159B1. A radiation-hardened (rad-hard) computing system can include a rad-hard processor, a second processor, and a memory operably coupled to the rad-hard processor. The rad-hard processor can cause the second processor to execute compute-intensive tasks that can be performed more quickly or with fewer computing resources by the second processor...
Heterogeneously integrated acoustoelectric amplifiers
Patent • #US11948979B1. An acoustoelectric amplifier and a number of corresponding devices are disclosed, along with methods for making the same. The acoustoelectric amplifier employs wafer-scale bonding to heterogeneously integrate an epitaxial III-V semiconductor stack and a piezoelectric layer. To increase the acoustic gain with low power dissipation, the electromechanical coupling coefficient...
Heterogeneously integrated electro-optic modulator
Patent • #US10788689B1. In an electro-optical modulator, an electro-optical modulation layer is bonded to a cladding layer that overlies a substrate. A modulation zone waveguide is optically coupled to the electro-optical modulation layer and optically coupled to an I/O waveguiding structure embedded in the cladding layer. The I/O waveguiding structure is conformed...
Hexahedral finite element mesh coarsening using pillowing technique
Patent • #US8194068B1. A techniques for coarsening a hexahedral mesh is described. The technique includes identifying a coarsening region within a hexahedral mesh to be coarsened. A boundary sheet of hexahedral elements is inserted into the hexahedral mesh around the coarsening region. A column of hexahedral elements is identified within the boundary...
Hierarchical clustering using correlation metric and spatial continuity constraint
Patent • #US8280887B1. Large data sets are analyzed by hierarchical clustering using correlation as a similarity measure. This provides results that are superior to those obtained using a Euclidean distance similarity measure. A spatial continuity constraint may be applied in hierarchical clustering analysis of images.
High Accuracy Non-A/C Powered Leak Tester and Volume Calibrator
Featured Opportunity • This novel invention relates to a portable, pneumatically -controlled instrument capable of generating a vacuum (less than 10 Torr), calibrating volumes, and performing quantitative leak tests, all without the use of A/C power. This means testing will not be disrupted when working in sensitive or hazardous environments (e.g., flammable or...
High aspect ratio gratings fabricated by electrodeposition
Patent • #US11798844B1. A method is provided for making gratings of gold or other metal in silicon substrates. The disclosed method may achieve high aspect ratios. According to the disclosed method, a silicon wafer is through-etched. A seed layer of metal is vapor-deposited on one side of the wafer, and a layer...
High current density, low contact resistance wide bandgap contacts
Patent • #US10505031B1. A high current density, low contact resistance contact for wide bandgap (WBG) or ultra-wide bandgap materials (UWBG) is disclosed. The contact is lithographically formed so that a total perimeter length of the contact structure is at least twice the length of the side of a contact pad closest to...
High data rate atom interferometric device
Patent • #US9086429B1. A light-pulse atomic interferometry (LPAI) apparatus is provided. The LPAI apparatus comprises a vessel, two sets of magnetic coils configured to magnetically confine an atomic vapor in two respective magneto-optical traps (MOTs) within the vessel when activated, and an optical system configured to irradiate the atomic vapor within the...
High data-rate atom interferometers through high recapture efficiency
Patent • #US8941053B1. An inertial sensing system includes a magneto-optical trap (MOT) that traps atoms within a specified trapping region. The system also includes a cooling laser that cools the trapped atoms so that the atoms remain within the specified region for a specified amount of time. The system further includes a...
High durability solar absorptive coating and methods for making same
Patent • #US9499699B1. The present invention relates to solar absorptive coatings including a ceramic material. In particular, the coatings of the invention are laser-treated to further enhance the solar absorptivity of the material. Methods of making and using such materials are also described.
High efficiency III-nitride light-emitting diodes
Patent • #US8451877B1. Tailored doping of barrier layers enables balancing of the radiative recombination among the multiple-quantum-wells in III-Nitride light-emitting diodes. This tailored doping enables more symmetric carrier transport and uniform carrier distribution which help to reduce electron leakage and thus reduce the efficiency droop in high-power III-Nitride LEDs. Mitigation of the...
High entropy alloys, refractory high entropy alloys, methods of selecting and making, and structures formed thereof
Patent • #US11434551B1. The present disclosure is directed to novel high entropy alloys, including refractory high entropy alloys, and methods of selecting high entropy alloys and refractory high entropy alloys with select nuclear application predetermined properties.
High entropy alloys, refractory high entropy alloys, methods of selecting and making, and structures formed thereof
Patent • #US12331384B1. The present disclosure is directed to novel high entropy alloys, including refractory high entropy alloys, and methods of selecting high entropy alloys and refractory high entropy alloys with select nuclear application predetermined properties.
High extraction efficiency ultraviolet light-emitting diode
Patent • #US9196788B1. Ultraviolet light-emitting diodes with tailored AlGaN quantum wells can achieve high extraction efficiency. For efficient bottom light extraction, parallel polarized light is preferred, because it propagates predominately perpendicular to the QW plane and into the typical and more efficient light escape cones. This is favored over perpendicular polarized light...
High force vibration testing with wide frequency range
Patent • #US8408066B1. A shaker assembly for vibration testing includes first and second shakers, where the first shaker includes a piezo-electric material for generating vibration. A support structure permits a test object to be supported for vibration of the test object by both shakers. An input permits an external vibration controller to...
High Performance Dual-Mode Oscillator Circuits
Featured Opportunity • Dual-mode oscillator architectures for use with SC cut resonators Sandia researchers have developed two architectures that allow dual oscillators to operate simultaneous modes from a single resonator with a high degree of mode isolation. These techniques present a practical and more easily implemented pathway for the SC resonator type dual...
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