Heating and cooling devices, systems and related method

Patent Number: 10,876,773
Issued: 12/29/2020
Official Filing: View the Complete Patent
Abstract: Embodiments disclosed herein relate to devices, systems, and methods for cooling and/or heating a medium as well as cooling and/or heating an environment containing the medium. More specifically, at least one embodiment includes a heat pump that may heat and/or cool a medium and, in some instances, may transfer heat from one location to another location.
Filed: 8/21/2019
Application Number: 16/546,465
Government Interests: STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention.