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Patent • #US8516269B1. Detection and deterrence of device tampering and subversion may be achieved by including a cryptographic fingerprint unit within a hardware device for authenticating a binding of the hardware device and a physical structure. The cryptographic fingerprint unit includes an internal physically unclonable function ("PUF") circuit disposed in or on...

Patent • #US10445530B1. An apparatus for intrusion detection includes processing circuitry, a switch, signal detection circuitry, and an analog-to-digital converter (“ADC”). The processing circuitry is coupled to send a challenge signal to a device when the device is coupled to the processing circuitry. The switch is coupled to be enabled and disabled...

Patent • #US11188683B2. An apparatus for intrusion detection includes processing circuitry, a switch, signal detection circuitry, and an analog-to-digital converter (“ADC”). The processing circuitry is coupled to send a challenge signal to a device when the device is coupled to the processing circuitry. The switch is coupled to be enabled and disabled...

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Patent • #US9207023B2. Systems and methods for a forced-convection heat exchanger are provided. In one embodiment, heat is transferred to or from a thermal load in thermal contact with a heat conducting structure, across a narrow air gap, to a rotating heat transfer structure immersed in a surrounding medium such as air.

Patent • #US8228675B2. Systems and methods for a forced-convection heat exchanger are provided. In one embodiment, heat is transferred to or from a thermal load in thermal contact with a heat conducting structure, across a narrow air gap, to a rotating heat transfer structure immersed in a surrounding medium such as air.

Patent • #US8988881B2. Systems and methods for a forced-convection heat exchanger are provided. In one embodiment, heat is transferred to or from a thermal load in thermal contact with a heat conducting structure, across a narrow air gap, to a rotating heat transfer structure immersed in a surrounding medium such as air.

Patent • #US10036581B1. Embodiments of the invention are directed to heat exchanger assemblies, systems, and methods for conditioning medium in an environment (e.g., in a controlled environment) to a suitable temperature. In particular, embodiments may include heat transfer assemblies and medium conditioning systems that may condition the medium in the environment by...

Patent • #US10041701B1. Embodiments disclosed herein relate to devices, systems, and methods for cooling and/or heating a medium as well as cooling and/or heating an environment containing the medium. More specifically, at least one embodiment includes a heat pump that may heat and/or cool a medium and, in some instances, may transfer...

Patent • #US10876773B2. Embodiments disclosed herein relate to devices, systems, and methods for cooling and/or heating a medium as well as cooling and/or heating an environment containing the medium. More specifically, at least one embodiment includes a heat pump that may heat and/or cool a medium and, in some instances, may transfer...

Patent • #US10429105B1. Embodiments disclosed herein relate to devices, systems, and methods for cooling and/or heating a medium as well as cooling and/or heating an environment containing the medium. More specifically, at least one embodiment includes a heat pump that may heat and/or cool a medium and, in some instances, may transfer...

Patent • #US12705771B2. Various embodiments may include collecting, by an unmanned aerial vehicle (UAV), a measuring image of an assessed heliostat in a heliostat field. The measuring image of the assessed heliostat includes an assessed facet forming a reflective surface of the assessed heliostat. At least a portion of a reference heliostat...

Patent • #US10931059B1. A hermetically-sealed edge-connect header that can withstand high temperatures, high pressures (or high vacuum levels), and high vibration environments, along with two corresponding connectors are disclosed. After brazing the edge-connect header components, the assembly is machined to form a slot with a portion of each of a plurality of...

Patent • #US11424572B2. A hermetically-sealed edge-connect header that can withstand high temperatures, high pressures (or high vacuum levels), and high vibration environments, along with two corresponding connectors are disclosed. After brazing the edge-connect header components, the assembly is machined to form a slot with a portion of each of a plurality of...

Patent • #US11296454B2. A hermetically-sealed edge-connect header that can withstand high temperatures, high pressures (or high vacuum levels), and high vibration environments, along with two corresponding connectors are disclosed. After brazing the edge-connect header components, the assembly is machined to form a slot with a portion of each of a plurality of...

Patent • #US11990252B2. A combination of materials and processing parameters have been developed for hermetic seals for electrical feedthroughs in high performance applications. A glass-ceramic forms a hermetic seal between a stainless steel shell and a platinum-nickel-based (Pt—Ni) pin alloy for electrical feedthroughs. The glass-ceramic is processed to develop a coefficient of...

Patent • #US8482739B1. A heterodyne photomixer spectrometer comprises a receiver photomixer that is driven at a different frequency than the source photomixer, thereby maintaining the coherent nature of the detection, eliminating etalon effects, and providing not only the amplitude but also the phase of the received signal. The heterodyne technique can be...

Patent • #US11675126B1. A hybrid photonic integrated circuit and a method of its manufacture are provided. A SiP functional layer is fabricated on an SOI wafer. A lithium niobate thin film is bonded to the SiP functional layer. The silicon handle layer is removed from the SOI wafer to expose buried oxide,...

Patent • #US12079159B1. A radiation-hardened (rad-hard) computing system can include a rad-hard processor, a second processor, and a memory operably coupled to the rad-hard processor. The rad-hard processor can cause the second processor to execute compute-intensive tasks that can be performed more quickly or with fewer computing resources by the second processor...

Patent • #US12627294B1. Structural modularity is critical to solid-state transformer (SST) and solid-state power substation (SSPS) concepts, but operational aspects related to this modularity are not yet fully understood. Previous studies and demonstrations of modular power conversion systems assume identical module compositions, but dependence on module uniformity undercuts the value of the...

Patent • #US11948979B1. An acoustoelectric amplifier and a number of corresponding devices are disclosed, along with methods for making the same. The acoustoelectric amplifier employs wafer-scale bonding to heterogeneously integrate an epitaxial III-V semiconductor stack and a piezoelectric layer. To increase the acoustic gain with low power dissipation, the electromechanical coupling coefficient...

Patent • #US10788689B1. In an electro-optical modulator, an electro-optical modulation layer is bonded to a cladding layer that overlies a substrate. A modulation zone waveguide is optically coupled to the electro-optical modulation layer and optically coupled to an I/O waveguiding structure embedded in the cladding layer. The I/O waveguiding structure is conformed...

Patent • #US8194068B1. A techniques for coarsening a hexahedral mesh is described. The technique includes identifying a coarsening region within a hexahedral mesh to be coarsened. A boundary sheet of hexahedral elements is inserted into the hexahedral mesh around the coarsening region. A column of hexahedral elements is identified within the boundary...

Patent • #US8280887B1. Large data sets are analyzed by hierarchical clustering using correlation as a similarity measure. This provides results that are superior to those obtained using a Euclidean distance similarity measure. A spatial continuity constraint may be applied in hierarchical clustering analysis of images.