Integrated photonic encoding systems and methods for high speed and low power image processing
| DWPI Title: Semiconductor-based photonic processing system i.e. silicon-photonic processing system, used in e.g. remote-sensing, has optical receiver for detecting portion of optical signals and outputting electrical representation of output vector |
| Abstract: A method performed by a photonics processing system includes encoding an input vector into first optical signals; performing an optical scattering of the first optical signals to form second optical signals, the optical scattering implementing a matrix multiplication of the input vector by a quasi-random matrix; detecting at least a portion of the second optical signals representing an output vector; and encoding the second optical signals in an electrical representation of the output vector. |
| Use: Semiconductor-based photonic processing system i.e. silicon-photonic processing system, used in such as remote-sensing, surveillance, global monitoring, sensing, and spectroscopy. |
| Advantage: The system is integrable into low size, weight, and power (SWaP) packages to enable use in a wide range of platforms and has low power consumption and high processing speeds. The system is configured to encode an input vector into first optical signals. The system convert information of pixels of an image to the first optical signals via encoding using modulators. The system performs an optical scattering of the first optical signals to form second optical signals, detect portion of the second optical signals, and output an electrical representation of an output vector and allows for data to be processed more quickly, and with less power. The overall speed of the photonic processing system is limited by the speed of the optical encoder and/or the optical signal modulators used to encode the input vector. |
| Novelty: The system (100) has photonic processor (110) that is in optical communication with the optical encoder (104). An optical receiver (124) is in optical communication with the photonic processor. The optical receiver is configured to detect portion of the second optical signals and output an electrical representation of the output vector. The scattering centers (116) are cylindrical voids extending through a thickness of the photonic processor, where the cylindrical voids have a refractive index of about one, and the refractive index of the material comprising the photonic processor is greater than one. The scattering region (114) is an inverse designed photonic structure that is configured to implement the matrix multiplication of the input vector by the quasi-random matrix. |
| Filed: 7/6/2023 |
| Application Number: US18218704A |
| Tech ID: SD 15813.0 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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