Flexible Quantum Computing Cable for Multi-Qubit Integration

A flexible interconnect characterized by high trace density, high electrical conductivity, and low thermal conductivity is disclosed. The flexible interconnect comprises a flexible substrate, such as polyimide, with an aerosol jet printed (AJP) seed layer that supports fine conductive traces. An electrodeposited rhenium film is applied adjacent to these conductive traces, enhancing electrical performance by becoming superconducting at temperature below approximately 6 K. A conformal passivation layer provides electrical insulation and chemical protection, preventing oxidation of the rhenium film. The unique combination of the AJP seed layer, which maintains high conductivity at elevated temperatures, and the superconducting properties of the rhenium at lower temperatures, enables the flexible interconnect to operate effectively across a wide temperature range. This design allows for a high trace density while minimizing overall thermal conductivity, making the flexible interconnect particularly advantageous for applications in quantum computing and other cryogenic operating temperature devices and their characterization.