Waveguide module comprising a first plate with a waveguide channel and a second plate with a raised portion in which a sealing layer is forced into the waveguide channel by the raised portion
| DWPI Title: Waveguide module, has raised portion that deforms first portion of sealing layer such that first portion of sealing layer is forced into opening of waveguide channel sealing discontinuity |
| Abstract: The various technologies presented herein relate to utilizing a sealing layer of malleable material to seal gaps, etc., at a joint between edges of a waveguide channel formed in a first plate and a surface of a clamping plate. A compression pad is included in the surface of the clamping plate and is dimensioned such that the upper surface of the pad is less than the area of the waveguide channel opening on the first plate. The sealing layer is placed between the waveguide plate and the clamping plate, and during assembly of the waveguide module, the compression pad deforms a portion of the sealing layer such that it ingresses into the waveguide channel opening. Deformation of the sealing layer results in the gaps, etc., to be filled, improving the operational integrity of the joint. |
| Use: Waveguide module. |
| Advantage: The waveguide module can comprise a complex network of waveguides that can be easily manufactured, having a low cost, with a high reliability of operation. The sealing layer is utilized to seal the waveguide channel to create a waveguide manifold formed by the waveguide plate configuration and the clamping plate, thus enabling the waveguide manifold to support a desired electromagnetic modality. The waveguide module is configured to minimize and/or eliminate RF leakage during operation of the waveguide module. The benefit of using a material with an inherent degree of elasticity is that relaxation can occur in one or more components and/or materials forming the waveguide module are compensated for by expansion of the elastic material, thus enabling pressure to be continually applied by the compression pad to the sealing layer. |
| Novelty: The waveguide module has a sealing layer that is located between first and second plate. An upper surface (170) of sealing layer is located adjacent to first surface of first plate and waveguide channel opening. The sealing layer lower surface is located adjacent to the second surface of second plate and raised portion. The raised portion deforms a first portion of sealing layer such that first portion of the sealing layer is forced into opening of waveguide channel sealing a discontinuity between edge of waveguide channel opening and second surface of second plate. |
| Filed: 5/19/2016 |
| Application Number: US15159377A |
| Tech ID: SD 13626.0 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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