Tensile-stressed microelectromechanical apparatus and microelectromechanical relay formed therefrom
| DWPI Title: Microelectromechanical MEM apparatus used as movable stage or MEM relay in microscopy has shuttle having mesh structure, suspended above substrate by sets of tensile-stressed beams located on at least two sides of shuttle |
| Abstract: A microelectromechanical (MEM) apparatus is disclosed which includes a shuttle suspended above a substrate by two or more sets of tensile-stressed beams which are operatively connected to the shuttle and which can comprise tungsten or a silicon nitride/polysilicon composite structure. Initially, the tensile stress in each set of beams is balanced. However, the tensile stress can be unbalanced by heating one or more of the sets of beams; and this can be used to move the shuttle over a distance of up to several tens of microns. The MEM apparatus can be used to form a MEM relay having relatively high contact and opening forces, and with or without a latching capability. |
| Use: MEM apparatus used as a movable stage or MEM relay in microscopy, e.g. atomic force microscopy. |
| Advantage: The tensile-stressed MEM apparatus can be formed with or without a latching capability. Stress is compensated during fabrication of the MEM apparatus. Provides a higher voltage and lower current for actuation of the MEM apparatus due to the use of silicon nitride and polysilicon to form the tensile-stressed beams, while at the same time providing a higher electrical conductivity for the shuttle, electrodes and contact pads by using tungsten and titanium nitride. |
| Novelty: The MEM apparatus (10) has a substrate (12); and a shuttle (14) having a mesh structure, and suspended above the substrate by sets of tensile-stressed beams (16,18) located on at least two sides of the shuttle. The shuttle is pulled in a direction substantially parallel to the substrate in response to a tensile stress in an unheated first set of the tensile-stressed beams on one side of the shuttle upon heating a second set of the tensile-stressed beams on an opposite side of the shuttle. |
| Filed: 4/11/2005 |
| Application Number: US2005103311A |
| Tech ID: SD 7693.0 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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