Self-insulating metal vias in magnetic micro-devices
| DWPI Title: Magnetic micro-device e.g. toroid micro-inductor, for use in electronic applications, has top wire layer formed on top surface of magnetic nanocomposite film layer, where bottom wire layer, vias, and top layer form continuous coil |
| Abstract: A magnetic micro-device and process to manufacture the same is disclosed. The magnetic micro-device has a near-zero conductivity magnetic nanocomposite film layer with a plurality of apertures through which a corresponding plurality of electrical conductors (vias) pass. Due to the near-zero conductivity of the magnetic nanocomposite film layer, the vias are self-insulating. The presence of the magnetic nanocomposite film layer results in greater inductance than that possible with an air core (or core-less) magnetic micro-device. Potential magnetic micro-devices include toroid micro-inductors, solenoid micro-inductors, toroid micro-transformers, and solenoid micro-transformers. Additional potential magnetic micro-devices include generators, motors, electromagnetic switches, and voice coils (for speakers or microphones). The process used to manufacture the magnetic micro-device can be scaled to cost-effectively produce large numbers of the magnetic micro-device. |
| Use: Magnetic micro-device. Uses include but are not limited to toroid micro-inductor, solid-core solenoid, toroid and solenoids. |
| Advantage: The magnetic nanocomposite film layer results in greater inductance than that possible with an air core (or core-less) magnetic micro-device. The process used to fabricate the magnetic micro device can be scaled to cost-effectively produce large numbers of the magnetic device. The magnetic device has appreciable inductances that are amenable to mass production. Due to the near-zero conductivity of the film layer, the vias are self-insulating. |
| Novelty: A magnetic micro-device comprises a magnetic nanocomposite film layer on a top surface of a bottom wire layer, and having near-zero conductivity, and including apertures; vias within the aperture; and a top wire layer on top surface and top surfaces of the film layer and vias. The vias electrically interconnect the bottom and top wire layers. The bottom wire, vias, and/or top layer in combination form at least one continuous coil. Each of the wire layers comprises gold, silver, copper, or aluminum. Each wire layer has a thickness of 0.5-1 mm. |
| Filed: 7/15/2021 |
| Application Number: US17376496A |
| Tech ID: SD 15172.1 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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