Self-assembly assisted additive manufacturing of thermosets
| DWPI Title: Self-assembly-assisted additive manufacture of thermoset used as e.g. adhesive, involves printing formulation comprising epoxy monomer, self-assembly monomer which is 1,4-dihydropyrimidin-4-one compound, and curative monomer and curing printed structure |
| Abstract: The present invention relates to formulations including a self-assembly monomer. In particular embodiments, the self-assembly monomer provides a thermoset having beneficial viscoelastic properties for printing methodologies. Methods of making and using such formulations are also provided. |
| Use: Self-assembly-assisted additive manufacture of thermoset i.e. three-dimensional printed thermoset. Uses include but are not limited to adhesive, encapsulant, support, coating, electronics, civil engineering application, structural composite, tooling, aerospace application, and defense application. |
| Advantage: The method produces thermoset using the self-assembly monomer which provides beneficial viscoelastic properties for printing methodologies, by efficiently controlling interfacial interactions in three-dimensional printed component and promoting efficient interlayer adhesion. |
| Novelty: Self-assembly-assisted additive manufacture of thermoset involves providing a formulation comprising an epoxy monomer comprising one or more epoxy groups, a self-assembly monomer which is 1,4-dihydropyrimidin-4-one compound (I) or (Ia) or its salt, a curative monomer comprising one or more reactive moieties configured to react with the epoxy group(s) of the epoxy monomer, and an optional filler, printing a structure with the formulation at a temperature (T1) of 20-40℃ to obtain a printed structure, and curing the printed structure at a temperature (T2) which is greater than temperature (T1) to obtain a cured structure. |
| Filed: 6/26/2019 |
| Application Number: US16453431A |
| Tech ID: SD 14615.1 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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