Push plate, mounting assembly, circuit board, and method of assembling thereof for ball grid array packages
| Patent Number: | 9,653,230 |
| Issued: | 5/16/2017 |
| Official Filing: | View the Complete Patent |
| Abstract: | A push plate that includes springs in the form of cantilever flexures and an inspection window is disclosed. The push plate provides a known, uniform, down force and minimal torque to a package to be tested. The cantilevers have a known, calculable down force producing stiffness. The window provides for viewing of the package during testing. |
| Filed: | 2/14/2013 |
| Application Number: | 13/767,578 |
| Government Interests: | STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |