| Abstract: Internal nodes of a constituent integrated circuit (IC) package of a
multichip module (MCM) are protected from excessive charge during plasma
cleaning of the MCM. The protected nodes are coupled to an internal
common node of the IC package by respectively associated discharge paths.
The common node is connected to a bond pad of the IC package. During MCM
assembly, and before plasma cleaning, this bond pad receives a wire bond
to a ground bond pad on the MCM substrate. |
| Filed: 7/18/2013 |
| Application Number: 13/945074 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
| Attribution for Derwent World Patents Index Records published on Sandia ® Clarivate. All rights reserved. Republication or redistribution of Clarivate content, including by framing or similar means, is prohibited without the prior written consent of Clarivate. Clarivate and its logo, as well as all other trademarks used herein are trademarks of their respective owners and used under license. |