| Abstract: Precise annealing of identified defective regions of a Focal Plane Array
("FPA") (e.g., exclusive of non-defective regions of the FPA) facilitates
removal of defects from an FPA that has been hybridized and/or packaged
with readout electronics. Radiation is optionally applied under operating
conditions, such as under cryogenic temperatures, such that performance
of an FPA can be evaluated before, during, and after annealing without
requiring thermal cycling. |
| Filed: 8/1/2013 |
| Application Number: 13/956868 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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