Plasmon-assisted optical vias for photonic ASICS

Patent Number: 9,599,781
Issued: 3/21/2017
Official Filing: View the Complete Patent
Abstract: The present invention relates to optical vias to optically connect multilevel optical circuits. In one example, the optical via includes a surface plasmon polariton waveguide, and a first optical waveguide formed on a first substrate is coupled to a second optical waveguide formed on a second substrate by the surface plasmon polariton waveguide. In some embodiments, the first optical waveguide includes a transition region configured to convert light from an optical mode to a surface plasmon polariton mode or from a surface plasmon polariton mode to an optical mode.
Filed: 9/8/2015
Application Number: 14/847,806
Government Interests: STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention.