PHOTOLITHOGRAPHY OF ATOMIC LAYER RESIST

Patent Number: 11,424,135
Issued: 8/23/2022
Official Filing: View the Complete Patent
Application Number: 182,838/17
Government Interests: STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention.