Photoelectrochemically driven self-assembly method
| DWPI Title: Assembly method of electronic devices in microsystem involves biasing electrodes on receiving substrate to attract and form connections with electronic devices having functionalized regions on surfaces |
| Abstract: Various technologies described herein pertain to assembling electronic devices into a microsystem. The electronic devices are disposed in a solution. Light can be applied to the electronic devices in the solution. The electronic devices can generate currents responsive to the light applied to the electronic devices in the solution, and the currents can cause electrochemical reactions that functionalize regions on surfaces of the electronic devices. Additionally or alternatively, the light applied to the electronic devices in the solution can cause the electronic devices to generate electric fields, which can orient the electronic devices and/or induce movement of the electronic devices with respect to a receiving substrate. Further, electrodes on a receiving substrate can be biased to attract and form connections with the electronic devices having the functionalized regions on the surfaces. The microsystem can include the receiving substrate and the electronic devices connected to the receiving substrate. |
| Use: Assembly method of electronic devices (claimed) in microsystem. |
| Advantage: Electric fields are generated in response to the application of the light to the electronic devices to orient the electronic devices with respect to the receiving substrate and/or induce movement of the electronic devices with respect to the receiving substrate, thus, electric fields enabling orientation and/or movement of the electronic devices to be controlled to facilitate assembly of the electronic devices into the microsystem. |
| Novelty: The assembly method involves disposing electronic devices (102) in solution (202) and then applying it with light while in the solution. The electronic devices generate current responsive to the applied light, and the current causes electrochemical reactions that functionalize the regions on the surfaces of the electronic devices. Electrodes (208,210,212) are biased on the receiving substrate to attract and form connections with the electronic devices having the functionalized regions on the surfaces, with the electronic devices connected to the receiving substrate (204) of microsystem. |
| Filed: 10/23/2013 |
| Application Number: US14061576A |
| Tech ID: SD 10957.1 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
| Data from Derwent World Patents Index, provided by Clarivate All rights reserved. Republication or redistribution of Clarivate content, including by framing or similar means, is prohibited without the prior written consent of Clarivate. Clarivate and its logo, as well as all other trademarks used herein are trademarks of their respective owners and used under license. |