Monolithic MAX phase ternary alloys for sliding electrical contacts

DWPI Title: Electrical contact assembly for electrical components, has tribofilm that includes copper oxide and is disposed between first contact and second contact and arises from sliding engagement between first and second contacts
Abstract: The present invention relates to monolithic structures for use as an electrical contact. In particular, these structures are formed from a laminate alloy, which in turn is composed of a Mn+1AXn compound. Electrical contact assemblies and electrical components having such contacts are also described herein. In some example, such monolithic structures display increased wear resistance, which is useful for sliding electrical contacts.
Use: Electrical contact assembly for electrical components (claimed).
Advantage: The electrical contact assembly uses monolithic phase alloy materials which are bulk, relatively inexpensive, easy to manufacture, highly wear resistant, and highly electrically and thermally conductive. The formation of stable tribofilm provides low friction coefficient and electrical contact resistance values that are stable.
Novelty: The electrical contact assembly (200) has a first contact (201) that includes copper or copper alloy, and a second contact (202) that is configured for conductive engagement with the first contact. The second contact includes a monolithic structure that comprises titanium, aluminum or silicon, and carbon or nitrogen. The monolithic structure comprises a spark plasma sintered laminate alloy. A tribofilm is disposed between the first contact and the second contact and includes copper oxide. The tribofilm arises from a sliding engagement between the first contact and the second contact.
Filed: 5/12/2016
Application Number: US15153453A
Tech ID: SD 13255.1
This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention.
Data from Derwent World Patents Index, provided by Clarivate
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