Microfluidic package and method of making the same
| Patent Number: | 10,717,079 |
| Issued: | 7/21/2020 |
| Official Filing: | View the Complete Patent |
| Abstract: | The present invention relates to encapsulated microfluidic packages and methods thereof. In particular embodiments, the package includes a device, a cradle configured to support the device, and a lid having a bonding surface configured to provide a fluidic seal between itself and the device and/or cradle. Other package configurations, as well as methods for making such fluidic seals, are described herein. |
| Filed: | 1/25/2017 |
| Application Number: | 15/415,675 |
| Government Interests: | STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |