| Abstract: The present invention relates to encapsulated microfluidic packages and
methods thereof. In particular embodiments, the package includes a
device, a cradle configured to support the device, and a lid having a
bonding surface configured to provide a fluidic seal between itself and
the device and/or cradle. Other package configurations, as well as
methods for making such fluidic seals, are described herein. |
| Filed: 1/25/2017 |
| Application Number: 15/415675 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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