Microfluidic hubs, systems, and methods for interface fluidic modules
| DWPI Title: Microfluidic hub of system for interfacing fluidic modules, has fluid conduit that delivers fluid droplet to space between substrate and surface of second substrate from space between substrate and surface of second substrate |
| Abstract: Embodiments of microfluidic hubs and systems are described that may be used to connect fluidic modules. A space between surfaces may be set by fixtures described herein. In some examples a fixture may set substrate-to-substrate spacing based on a distance between registration surfaces on which the respective substrates rest. Fluidic interfaces are described, including examples where fluid conduits (e.g. capillaries) extend into the fixture to the space between surfaces. Droplets of fluid may be introduced to and/or removed from microfluidic hubs described herein, and fluid actuators may be used to move droplets within the space between surfaces. Continuous flow modules may be integrated with the hubs in some examples. |
| Use: Microfluidic hub of system (claimed) for interfacing fluidic modules. |
| Advantage: The droplets are introduced to fixtures with nanoliter precision, thus the variety of fluid operations are facilitated and robust fluidic delivery and withdrawal to and from the system is allowed. Since the simple hermetic sealing of the space between substrates is provided, the transfer of contaminants from the environment into the assembled device is prevented. |
| Novelty: The hub (1305) has a frame that is provided with access ports to access to a space between a substrate and a surface of a second substrate. A fluid conduit (1311) is in fluid communication with the space between substrate and surface of second substrate. The fluid conduit is positioned to deliver a fluid droplet to the space between substrate and surface of second substrate from the space between substrate and surface of second substrate. A droplet actuator is configured to move the fluid droplet within the space between the substrate and the surface of second substrate. |
| Filed: 4/25/2012 |
| Application Number: US13456135A |
| Tech ID: SD 11945.1 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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