Microelectromechanical resonator and method for fabrication
| DWPI Title: Micro-electromechanical resonator e.g. Lame resonator for e.g. filter of cell phone, has mass that includes holes whose location and size are provided correspondingly, so as to compensate uncertainty of resonant frequency of mass |
| Abstract: A method is disclosed for the robust fabrication of a microelectromechanical (MEM) resonator. In this method, a pattern of holes is formed in the resonator mass with the position, size and number of holes in the pattern being optimized to minimize an uncertainty Deltaf in the resonant frequency f0 of the MEM resonator due to manufacturing process variations (e.g. edge bias). A number of different types of MEM resonators are disclosed which can be formed using this method, including capacitively transduced Lamé, wineglass and extensional resonators, and piezoelectric length-extensional resonators. |
| Use: Micro-electromechanical (MEM) resonator such as Lame resonator, wineglass resonator and extensional resonator (all claimed) for filter and oscillator used in cell phone of wireless communication and radio-frequency (RF) system. |
| Advantage: The size and location of holes provided in mass correspondingly to minimize the uncertainty of resonant frequency, so that the manufacturing of MEM resonator can be improved. Hence, the high reliability and high fabrication yield of MEM resonator can be ensured. |
| Novelty: The micro-electromechanical (MEM) resonator (10) has mass (14) including holes, which is suspended above substrate (12) by anchor (16) for oscillating at resonant frequency. Every hole in mass is located at same distance from center of mass, and the hole location and hole size are provided correspondingly so as to compensate the uncertainty of resonant frequency. The electrodes (22,24) are located proximate to mass for stimulating the mass to oscillate at resonant frequency, and for sensing the oscillation of mass at the resonant frequency respectively. |
| Filed: 3/22/2007 |
| Application Number: US2007689567A |
| Tech ID: SD 10373.0 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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