Method for tuning thermal expansion properties in an additive manufacturing feedstock material
| DWPI Title: Feedstock material used in additive manufacturing apparatus, comprises material, where coefficient of thermal expansion for material is positive, and metal organic framework having nodes and linkers, and nodes are coupled to linkers, to form framework, and feedstock material is composite material |
| Abstract: A feedstock material for use in an additive manufacturing apparatus is prepared from a first material and a metal organic framework (MOF). The MOF comprises a plurality of nodes and a plurality of linkers, the plurality of linkers coupled to the plurality of nodes, thereby forming a framework. The MOF has a lower coefficient of thermal expansion than a coefficient of thermal expansion for the first material. As a result, the feedstock material has a reduced coefficient of thermal expansion as compared to the first material alone and thus exhibits low thermal expansion as its temperature is increased. The coefficient of thermal expansion for the MOF may be modified by using a different plurality of nodes and/or a different plurality of linkers, as well as by incorporating guest molecules or atoms into the framework of the MOF. |
| Use: The feedstock material is useful in additive manufacturing apparatus. |
| Advantage: The feedstock material has lower coefficient of thermal expansion than the first material. |
| Novelty: Feedstock material comprises a first material, where a coefficient of thermal expansion for the first material is positive, and a metal organic framework comprising a nodes and a linkers, and the nodes are coupled to the linkers, to form a framework, and a weight ratio of the first material to the metal organic framework is 0.5:0.5-0.995:0.005, and the feedstock material is a composite material, and the coefficient of thermal expansion for the metal organic framework is 10-25 wt.% lower than the coefficient of thermal expansion for the first material. |
| Filed: 9/27/2017 |
| Application Number: US15717265A |
| Tech ID: SD 14377.0 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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