Method for hermetic electrical connections
| DWPI Title: Method for providing hermetic electrical connection between two electrical components in aerospace application, involves mating metal pin in glass-ceramic material, and electrical connection provided between two electrical components |
| Abstract: A method of providing a hermetic, electrical connection between two electrical components by mating at least one metal pin in a glass-ceramic to metal seal connector to two electrical components, wherein the glass-ceramic to metal seal connector incorporates at least one metal pin encased (sealed) in a glass-ceramic material inside of a metal housing, with the glass-ceramic material made from 65-80% SiO2, 8-16% Li2O, 2-8% Al2O3, 1-5% P2O5, 1-8% K2O, 0.5-7% B2O3, and 0-5% ZnO. The connector retains hermeticity at temperatures as high as 700° C. and pressures as high as 500 psi. |
| Use: Method for providing hermetic electrical connection between two electrical components in an aerospace application. Uses include but are not limited to a communication satellite, microwave communications equipment, a military communication and a radar system. |
| Advantage: The method enables matching characteristics of an alloy and a glass to reduce residual stress in a seal. The glass has a highest possible corrosion resistance and better bonding effect with the pin and housing metal. The melting temperature of the glass is sufficiently low to permit a production of the glass ceramic in conventional furnaces. The glass has a high mechanical strength, so that the hermetic seal can withstand high external stresses such as pressure gradient, across the seal. |
| Novelty: The method involves mating a metal pin (12) in a glass-ceramic material. Electrical connection is provided between two electrical components. The pin is encased in a material inside a metal housing. The material is provided with 65-80 percent silicon dioxide (Si02), 8-1 percent lithium oxide (Li20), 2-8 percent aluminum oxide (Al2o3), 1-5 percent Phosphorus pentoxide (P205), 1-8 percent pottacium oxided (K20), 0.5-7 percent Boric oxide (B2o3), and 0-5 percent zinc oxide (ZnO). The pin is provided with a palladium-based alloy. |
| Filed: 11/11/2008 |
| Application Number: US2008268667A |
| Tech ID: SD 10578.1 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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