| Abstract: A nanosolder comprises a first metal nanoparticle core coated with a
second metal shell, wherein the first metal has a higher surface energy
and smaller atomic size than the second metal. For example, a bimetallic
nanosolder can comprise a protective Ag shell "glued" around a reactive
Cu nanoparticle. As an example, a 3-D epitaxial Cu-core and Ag-shell
structure was generated from a mixture of copper and silver nanoparticles
in toluene at temperatures as low as 150.degree. C. |
| Filed: 10/5/2015 |
| Application Number: 14/875468 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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