Low-inductance direct current power bus
| DWPI Title: Direct current power bus for power system apparatus for e.g., electric vehicles, has bus structure that overlies upper surface of insulative base, and is made up of metal plate and dielectric film is interposed between metal plates |
| Abstract: A DC power bus having reduced parasitic inductance and higher tolerable operating temperature is disclosed. In example embodiments, a bus structure overlies a printed circuit board, and an array of capacitors is arranged on a surface of the printed circuit board distal the bus structure. The bus structure comprises an upper metal plate, a lower metal plate, and a dielectric film interposed between the upper and lower metal plates. The capacitors are connected in parallel between conductive planes of the printed circuit board. The upper and lower metal plates of the bus structure are connected to respective conductive planes of the printed circuit board. |
| Use: Direct current power bus for power system apparatus (claimed) for e.g., electric vehicles, hybrid electric vehicles and solar photovoltaic power converters. |
| Advantage: Provides a flat profile that facilitates thermal management. Allows the direct current link capacitor to be reduced in size without reducing power, and conversely it allows the converter to process more power with the same or a smaller-size direct current link capacitor. Provides parallel capacitors which provides a low shunt impedance to the high-frequency current components in order to smooth out current spikes created by the switching operations in the power inverters and converters. The inductance is also reduced by using a printed circuit board to maximize the planar capacitance, and by carefully controlling the placement of capacitors on the printed circuit board such that the magnetic flux around contiguous components cancels. |
| Novelty: The direct current power bus has bus structure that overlies the upper surface of the insulative base member and capacitors are mounted in a capacitor array on at least the lower surface of the insulative base portion. The bus structure is made up of an upper metal plate (60), a lower metal plate, and a dielectric film (75) interposed between the upper and lower metal plate. The each capacitor (80) is electrically connected between the first and second laminated electrically conductive metal layers such that capacitors are connected in parallel with each other. The upper and lower metal plates of the bus structure are respectively electrically connected to the first and second laminated electrically conductive metal layers. |
| Filed: 2/7/2017 |
| Application Number: US15426844A |
| Tech ID: SD 13679.1 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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