| Abstract: The present invention relates to a lateral via to provide an electrical
connection to a buried conductor. In one instance, the buried conductor
is a through via that extends along a first dimension, and the lateral
via extends along a second dimension that is generally orthogonal to the
first dimension. In another instance, the second dimension is oblique to
the first dimension. Components having such lateral vias, as well as
methods for creating such lateral vias are described herein. |
| Filed: 6/7/2016 |
| Application Number: 15/175312 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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