| Abstract: The various technologies presented herein relate to measuring a signal
generated by a die-based test circuit incorporated into an IC, and
utilizing the measured signal to authenticate the IC. The signal can be
based upon a sensor response generated by the test circuit fabricated
into the die, wherein the sensor response is based upon a property of the
die material. The signal can be compared with a reference value obtained
from one or more test circuit(s) respectively located on one or more
reference dies, wherein the reference dies are respectively cut from
different wafers, and the location at which the reference dies were cut
is known. If the measured signal matches the reference value, the die is
deemed to be from the same cut location as the dies from which the
reference value was obtained. If the measured signal does not match the
reference value, the die is not authenticated. |
| Filed: 7/28/2016 |
| Application Number: 15/221814 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
| Attribution for Derwent World Patents Index Records published on Sandia ® Clarivate. All rights reserved. Republication or redistribution of Clarivate content, including by framing or similar means, is prohibited without the prior written consent of Clarivate. Clarivate and its logo, as well as all other trademarks used herein are trademarks of their respective owners and used under license. |