High resolution, non-contact removal rate module for serial sectioning
| Patent Number: | 10,260,865 |
| Issued: | 4/16/2019 |
| Official Filing: | View the Complete Patent |
| Abstract: | The present invention relates to a metallographic system including a measurement module configured to provide precise differential measurements of a sample after serial sectioning, as well as methods of employing such a module. In particular example, the measurement module provides differential measurement(s) without contacting the surface of a sample, thereby minimizing contamination of the sample surface. |
| Filed: | 9/14/2017 |
| Application Number: | 15/705,178 |
| Government Interests: | STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |