Heating and cooling devices, systems and related method
Patent Number: | 10,876,773 |
Issued: | 12/29/2020 |
Official Filing: | View the Complete Patent |
Abstract: | Embodiments disclosed herein relate to devices, systems, and methods for cooling and/or heating a medium as well as cooling and/or heating an environment containing the medium. More specifically, at least one embodiment includes a heat pump that may heat and/or cool a medium and, in some instances, may transfer heat from one location to another location. |
Filed: | 8/21/2019 |
Application Number: | 16/546,465 |
Government Interests: | STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |