| Abstract: An apparatus, method, and system, the apparatus and system including a
flexible microsystems enabled microelectronic device package including a
microelectronic device positioned on a substrate; an encapsulation layer
encapsulating the microelectronic device and the substrate; a protective
layer positioned around the encapsulating layer; and a reinforcing layer
coupled to the protective layer, wherein the substrate, encapsulation
layer, protective layer and reinforcing layer form a flexible and
optically transparent package around the microelectronic device. The
method including encapsulating a microelectronic device positioned on a
substrate within an encapsulation layer; sealing the encapsulated
microelectronic device within a protective layer; and coupling the
protective layer to a reinforcing layer, wherein the substrate,
encapsulation layer, protective layer and reinforcing layer form a
flexible and optically transparent package around the microelectronic
device. |
| Filed: 10/31/2013 |
| Application Number: 14/68189 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
| Attribution for Derwent World Patents Index Records published on Sandia ® Clarivate. All rights reserved. Republication or redistribution of Clarivate content, including by framing or similar means, is prohibited without the prior written consent of Clarivate. Clarivate and its logo, as well as all other trademarks used herein are trademarks of their respective owners and used under license. |