Electromagnetic isolation structure
| DWPI Title: Integrated circuit device for use in electronic device, has conductive layer located on upper surface of coating layer and connected with electromagnetic cage layer to form Faraday cage around radio frequency integrated circuit |
| Abstract: The various technologies presented herein relate to isolating an integrated circuit from electromagnetic radiation/interference. The integrated circuit can be encapsulated in a coating (e.g., a conformal coating). A conductive layer can be formed over the coating, where the conductive layer is deposited to connect with an electromagnetic shielding layer included in a substrate upon which the integrated circuit is located thereby forming a Faraday cage around the integrated circuit. Hollow spheres can be included in the coating to improve the dielectric constant of the coating. The conductive layer can be formed from at least one of metallic material or a polymer coating which includes conductive material. The integrated circuit can be utilized in conjunction with a heat sink and further, the integrated circuit can be of a flip chip configuration. |
| Use: Integrated circuit device for use in an electronic device. Uses include but are not limited to cellular phone, portable computer, laptop computer, global positioning system (GPS), radio detection and ranging system, navigation system and communication system. |
| Advantage: The device reduces manufacturing costs compared with incorporating a circuit board and associated inside an integrated circuit of a Faraday container so as to reduce overall size and complexity of the device. The device reduces the size of a semiconductor to improve speed, performance and density of integrated circuits. |
| Novelty: The device has a radio frequency integrated circuit (RFIC) (120) i.e. flip chip, located on a substrate (110). A coating layer (170) is deposited on the RFIC, where a lower surface of the coating layer covers the RFIC. The coating layer comprises spherical glass beads that are solid throughout. A conductive layer (380) is located on an upper surface of the coating layer, and includes an upper surface and a lower surface, where the lower surface of the conductive layer is in direct contact with the upper surface of the coating layer, and the upper surface of the coating layer is encased by the lower surface of the conductive layer. The conductive layer is connected with an electromagnetic cage layer (115) i.e. mesh, to form a Faraday cage around the RFIC, and comprises metallic material. The coating layer comprises one of a conformal coating, glob-top material, and epoxy resin. |
| Filed: 7/28/2014 |
| Application Number: US14444867A |
| Tech ID: SD 11093.0 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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