| Abstract: The various technologies presented herein relate to isolating an
integrated circuit from electromagnetic radiation/interference. The
integrated circuit can be encapsulated in a coating (e.g., a conformal
coating). A conductive layer can be formed over the coating, where the
conductive layer is deposited to connect with an electromagnetic
shielding layer included in a substrate upon which the integrated circuit
is located thereby forming a Faraday cage around the integrated circuit.
Hollow spheres can be included in the coating to improve the dielectric
constant of the coating. The conductive layer can be formed from at least
one of metallic material or a polymer coating which includes conductive
material. The integrated circuit can be utilized in conjunction with a
heat sink and further, the integrated circuit can be of a flip chip
configuration. |
| Filed: 7/28/2014 |
| Application Number: 14/444867 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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