| Abstract: | An optoelectronic device package and a method for its fabrication are
provided. The device package includes a lid die and an active die that is
sealed or sealable to the lid die and in which one or more optical
waveguides are integrally defined. The active die includes one or more
active device regions, i.e. integral optoelectronic devices or etched
cavities for placement of discrete optoelectronic devices. Optical
waveguides terminate at active device regions so that they can be coupled
to them. Slots are defined in peripheral parts of the active dies. At
least some of the slots are aligned with the ends of integral optical
waveguides so that optical fibers or optoelectronic devices inserted in
the slots can optically couple to the waveguides. |