Densified waste form and method for forming
| DWPI Title: Densified waste form for nuclear waste, has compacted metallic powder that is compacted at temperature below vaporization temperature that is ambient temperature of temperature sensitive material |
| Abstract: Materials and methods of making densified waste forms for temperature sensitive waste material, such as nuclear waste, formed with low temperature processing using metallic powder that forms the matrix that encapsulates the temperature sensitive waste material. The densified waste form includes a temperature sensitive waste material in a physically densified matrix, the matrix is a compacted metallic powder. The method for forming the densified waste form includes mixing a metallic powder and a temperature sensitive waste material to form a waste form precursor. The waste form precursor is compacted with sufficient pressure to densify the waste precursor and encapsulate the temperature sensitive waste material in a physically densified matrix. |
| Use: Densified waste form for nuclear waste. |
| Advantage: The densified waste form is formed with high mechanical strength, high durability, low waste outgassing and low rates of leaching into groundwater over large spans of time. The use of prohibitively expensive silver for both the getter material and the waste form is eliminated. The temperature sensitive material is isolated from the environment, thus the stability and the environmental resistance for the densified waste form is increased. |
| Novelty: The densified waste form (101) has a temperature sensitive waste material (105) containing iodine in a physically densified matrix. The compacted metallic powder (103) is compacted at a temperature below the vaporization temperature of the temperature sensitive material. The temperature below the vaporization temperature is ambient temperature. The metallic powder is made of tin, gold, silver and copper. The temperature sensitive waste material is made of silver iodide, silver iodide-zeolite, silver-silica aerogel, zinc iodide, copper iodide and bismuth-oxy-iodine compound. |
| Filed: 11/15/2013 |
| Application Number: US14081025A |
| Tech ID: SD 12540.0 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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