Crosslinked polymers with tunable coefficients of thermal expansion

DWPI Title: Curative for use in epoxy and polyurethane thermoset to reduce thermal expansion mismatch between encapsulant and objects that are encapsulated, comprises disubstituted dibenzocyclooctane, dibenzocycloheptane, stilbene or azobenzene
Abstract: Curatives and their resulting thermosets and other crosslinked polymers can reduce thermal expansion mismatch between an encapsulant and objects that are encapsulated. This can be accomplished by incorporating a negative CTE moiety into the thermoset resin or polymer backbone. The negative CTE moiety can be a thermal contractile unit that shrinks as a result of thermally induced conversion from a twist-boat to chair or cis/trans isomerization upon heating. Beyond CTE matching, other potential uses for these crosslinked polymers and thermosets include passive energy generation, energy absorption at high strain rates, mechanophores, actuators, and piezoelectric applications.
Use: Curatives for use in epoxy thermoset and polyurethane thermoset that are utilized for reducing thermal expansion mismatch between an encapsulant and objects that are encapsulated, and in passive energy generation, energy absorption at high strain rates, mechanophores, actuators, and piezoelectric applications
Advantage: Curative provides filler-less thermosets with tunable coefficients of thermal expansion.
Novelty: Curative comprises a disubstituted-dibenzocyclooctane, disubstituted-dibenzocycloheptane, disubstituted-stilbene or disubstituted-azobenzene.
Filed: 6/10/2021
Application Number: US17344717A
Tech ID: SD 15192.1
This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention.
Data from Derwent World Patents Index, provided by Clarivate
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