Detection and Tracking of Low Signal-to-Noise Ratio Moving Targets in Remote Sensing Imagery
| DWPI Title: Method for employing fluid vorticity to drive an underfilling process with a magnetic particle-loaded curing resin involves providing carrier chip; electrically interconnecting each die to carrier chip; preparing a curing resin by loading curing resin, applying magnetic particle-loaded curing resin |
| Abstract: A method and corresponding system for employing fluid vorticity to drive an underfilling process with a magnetic particle-loaded curing resin is disclosed. An applied multiaxial magnetic field drives the magnetic particles, and thus the curing resin, throughout the gap between a die and corresponding carrier chip. A magnetic field generator, for example, a set of triaxial Helmholtz coils, may be driven with different frequencies and phases along each axis, and may further include a DC component along one or more axes. To further minimize voids, the die and carrier chip may be placed in a vacuum oven to assist in removing any air pockets. |
| Use: Method for employing fluid vorticity to drive an underfilling process with a magnetic particle-loaded curing resin. |
| Advantage: The use of magnetic fields maximizes filling and minimizes segregation when underfilling with a magnetic particle-loaded curing resin. The die is robustly mechanically attached to the carrier chip, preferably in a manner that improves the reliability of the electrical interconnects. |
| Novelty: The method involves providing a carrier chip; providing one or more die;electrically interconnecting each of one or more die to carrier chip; preparing a curing resin by loading curing resin with magnetic particles, and creating a magnetic particle-loaded curing resin; applying magnetic particle-loaded curing resin along at least one edge of at least one of one or more die; subjecting one or more die and the carrier chip to a vacuum to remove at least a portion of air trapped in a space between one or more die and carrier chip; and subjecting one or more die and carrier chip to a multiaxial magnetic field to drive distribution of magnetic particle-loaded curing resin throughout space between one or more die and carrier chip. |
| Filed: 1/31/2023 |
| Application Number: US18103661A |
| Tech ID: SD 16054.0 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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