Process for epoxy foam production
| DWPI Title: Making epoxy foam comprises forming resin mixture of epoxy resin e.g. phenolic novolac with maleic anhydride compound and imidazole catalyst, adding surfactant e.g. organopolysiloxane compound to resin mixture and curing the foamed resin |
| Abstract: An epoxy resin mixture with at least one epoxy resin of between approximately 60 wt % and 90 wt %, a maleic anhydride of between approximately 1 wt % and approximately 30 wt %, and an imidazole catalyst of less than approximately 2 wt % where the resin mixture is formed from at least one epoxy resin with a 1-30 wt % maleic anhydride compound and an imidazole catalyst at a temperature sufficient to keep the maleic anhydride compound molten, the resin mixture reacting to form a foaming resin which can then be cured at a temperature greater than 50° C. to form an epoxy foam. |
| Use: The method is useful for making an epoxy foam. |
| Advantage: The method: promotes controlled and homogeneous foam formation; provides foaming and stabilization of the subsequent cellular structure; and provides foam with increased expansion, smaller cells, more uniform cell size and texture of the expanded formed product. |
| Novelty: Making an epoxy foam, comprises: forming a resin mixture of at least one epoxy resin with a maleic anhydride compound (1-50 wt.% ) and an imidazole catalyst at a temperature to keep the maleic anhydride compound molten, where a surfactant is added to the resin mixture that reacts to form a foaming resin; and curing the foaming resin at greater than 50° C to form an epoxy foam. |
| Filed: 12/16/2008 |
| Application Number: US2008335925A |
| Tech ID: SD 10311.0 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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