Wafer-level packaging with compression-controlled seal ring bonding
| DWPI Title: Method for providing device in sealed package for e.g. radio frequency microelectromechanical components, involves providing physical barrier against wafer surface movement between wafer surfaces other than seal rings |
| Abstract: A device may be provided in a sealed package by aligning a seal ring provided on a first surface of a first semiconductor wafer in opposing relationship with a seal ring that is provided on a second surface of a second semiconductor wafer and surrounds a portion of the second wafer that contains the device. Forcible movement of the first and second wafer surfaces toward one another compresses the first and second seal rings against one another. A physical barrier against the movement, other than the first and second seal rings, is provided between the first and second wafer surfaces. |
| Use: Method for providing a device in a sealed package for radio frequency microelectromechanical components. Uses include but are not limited to resonators, oscillators, switches, switched capacitors and varactors. |
| Advantage: The method enables providing the physical barrier against the movement of the wafer surfaces between the wafer surfaces other than the seal rings such that further movement of the wafers toward one another can be prevented, thus preventing further unnecessary compression of the seal rings. |
| Novelty: The method involves aligning a continuous metal seal ring (13) in opposing relationship with another continuous metal seal ring (14), where the seal rings are provided on surfaces of two respective semiconductor wafers (10, 11). Movement of the wafer surfaces is forcibly effected toward one another with the respective seal rings aligned in the opposing relationship. The seal rings are compressed against one another. A physical barrier is provided against the wafer surface movement between the wafer surfaces other than the seal rings. |
| Filed: 12/13/2011 |
| Application Number: US13324076A |
| Tech ID: SD 11857.0 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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