Localized temperature stability of low temperature cofired ceramics
| DWPI Title: Multilayer low temperature cofired ceramic (LTCC) module for high frequency application, has compensating material which is provided with temperature coefficient of resonant frequency opposite to LTCC |
| Abstract: The present invention is directed to low temperature cofired ceramic modules having localized temperature stability by incorporating temperature coefficient of resonant frequency compensating materials locally into a multilayer LTCC module. Chemical interactions can be minimized and physical compatibility between the compensating materials and the host LTCC dielectrics can be achieved. The invention enables embedded resonators with nearly temperature-independent resonance frequency. |
| Use: Multilayer low temperature cofired ceramic (LTCC) module for high frequency application. |
| Advantage: The compensating material is provided with temperature coefficient of resonant frequency opposite to LTCC, so that the localized temperature stability of the multilayer LTCC module can be ensured. The chemical interactions of the module can be minimized. The physical compatibility between compensating materials and host LTCC dielectrics can be achieved. The size of the resonator can be reduced. The dielectric loss occurred in the LTCC module can be reduced to enable high quality factor and narrow bandwidth. The temperature coefficient of resonant frequency of LTCC module can be ensured. |
| Novelty: The multilayer LTCC module has a LTCC layer (12,13) which is provided with a temperature coefficient of resonant frequency. A passive component (11) is arranged on the LTCC layer. A compensating material is provided with a temperature coefficient of resonant frequency opposite to LTCC. The compensating material is arranged on side of passive component. The ceramic filler is made of alumina. The compensating material is made of calcium titanate, and strontium titanate. |
| Filed: 9/26/2011 |
| Application Number: US13245535A |
| Tech ID: SD 11872.0 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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