MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads
| DWPI Title: Wafer-level process for packaging micro-electromechanical devices in hermetic microenvironment, involves removing portions of lid wafer to convert lid wafer into lid portions that correspond in alignment with micro-electromechanical device |
| Abstract: In wafer-level packaging of microelectromechanical (MEMS) devices a lid wafer is bonded to a MEMS wafer in a predetermined aligned relationship. Portions of the lid wafer are removed to separate the lid wafer into lid portions that respectively correspond in alignment with MEMS devices on the MEMS wafer, and to expose areas of the MEMS wafer that respectively contain sets of bond pads respectively coupled to the MEMS devices. |
| Use: Wafer-level process for packaging MEMS devices in hermetic microenvironment. |
| Advantage: The process enables packaging the MEMS devices using relatively low cost wafer level processes such as eutectic bonding, bosch etching and mechanical lapping and thinning so as to provide lower cost and higher production yields. The process enables exposing the MEMS and the lid wafer to oxygen plasma treatment to reduce surface moisture and other contaminants before aligning and bonding in a convenient manner. |
| Novelty: The process involves bonding a lid wafer (11) to a micro-electromechanical (MEMS) wafer (51) in a predetermined aligned relationship. Portions (52) of the lid wafer are removed to convert the lid wafer into lid portions that correspond in alignment with MEMS devices on the MEMS wafer by thinning the lid wafer after bonding and producing cavities (21, 23) in areas of the lid wafer that correspond in alignment with areas of the MEMS wafer before bonding based on the predetermined aligned relationship, where the thinning opens respective ends of the cavities. |
| Filed: 2/1/2012 |
| Application Number: US13364166A |
| Tech ID: SD 11897.0 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
| Data from Derwent World Patents Index, provided by Clarivate All rights reserved. Republication or redistribution of Clarivate content, including by framing or similar means, is prohibited without the prior written consent of Clarivate. Clarivate and its logo, as well as all other trademarks used herein are trademarks of their respective owners and used under license. |