Simultaneous sample manipulation and sensing using surface acoustic waves
| DWPI Title: Biosensor for use in medical diagnosis applications has transducers which are fabricated on substrate and have acoustic path capable of propagating second wave, in which acoustic paths intersect creating central sensing region |
| Abstract: The present invention provides a hexagonal, delay line surface acoustic wave device fabricated on a a piezoelectric substrate, such as lithium tantalate, coated with an insulating waveguide on to which a sensing film, such as an anti-human Interleukin-6 biosensor film, is physically absorbed. The acoustic waves that propagate along the delay lines of the SAW device provide for detection of biological species along one delay line and simultaneously provide for removal of non-specifically bound protein along the remaining delay lines. |
| Use: Biosensor for use in medical diagnosis applications. |
| Advantage: Provides an improved biosensor that exhibits desired characteristics superior to known biosensors by being able to provide simultaneous sensing and removal of non-specifically bound (NSB) proteins and to improve sensitivity and selectivity while simultaneously removing NSB proteins. Provides a delay line SAW device fabricated on an piezoelectric substrate having an insulating waveguide, which allows for simultaneous removal of NSB proteins and biological sensing by the propagation of differing waves along the different delay lines of the device. |
| Novelty: The biosensor has hexagonal surface acoustic wave (SAW) device (10) having a substrate (14), a waveguide, and inter-digital transducers (15). A first pair of transducers on the substrate has an acoustic path capable of propagating a first wave. The second and third pair of transducers is fabricated on the substrate and each having an acoustic path capable of propagating a second wave, in which the first, second, and third acoustic paths intersect creating a central sensing region (13). |
| Filed: 7/24/2008 |
| Application Number: US2008179184A |
| Tech ID: SD 11187.0 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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