Lateral electrodeposition of compositionally modulated metal layers
| DWPI Title: Formation method for laterally modulated metallic structure involves electrochemically depositing second metal layer on first metal sidewall in state in which second metal layer is deposited in sideways direction from first metal sidewall |
| Abstract: A method for making a laterally modulated metallic structure that is compositionally modulated in the lateral direction with respect to a substrate. |
| Use: Formation method for laterally modulated metallic structure. |
| Advantage: Improves the preparation process for compositionally modulated metal structures since the metal structure is modulated laterally and the layers are aligned with the surface of the metal sidewall in which they are electrodeposited. |
| Novelty: The method involves etching an exposed region of a first metal layer (12) to expose a substantially nonconductive substrate (11). The first metal layer is etched between a masking material and substantially nonconductive substrate for a distance to form a cavity (19) comprising a first metal sidewall (15) and an underside of masking material. The second metal layer is electrochemically deposited on first metal sidewall in a state in which the second metal layer is deposited in a sideways direction from first metal sidewall. The second metal layer includes predetermined types of metals. |
| Filed: 8/12/2010 |
| Application Number: US2010855080A |
| Tech ID: SD 7877.1 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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