Structured wafer for device processing

DWPI Title: Apparatus for fabricating semiconductor devices, has several passages that are extended from or along one surface of the structured wafer and to the top surface
Abstract: A structured wafer that includes through passages is used for device processing. Each of the through passages extends from or along one surface of the structured wafer and forms a pattern on a top surface area of the structured wafer. The top surface of the structured wafer is bonded to a device layer via a release layer. Devices are processed on the device layer, and are released from the structured wafer using etchant. The through passages within the structured wafer allow the etchant to access the release layer to thereby remove the release layer.
Use: Apparatus for fabricating semiconductor devices.
Advantage: The passages can be accessed by an etchant and surface area of the release layer exposed to the etchant is increased, so that release layer can be etched away within a relatively short time and the processed devices can be released from the structured wafer. The passages reduce the top surface area of the structured wafer that can form direct contact with devices after the release layer is removed, so that devices can been separated from the wafer easily. The textures of the device layer can be random or defined property for a specific application, so that light trapping can be improved.
Novelty: The apparatus has structured wafer (10) that comprises passages. A device layer is bonded to a top surface of structured wafer via a release layer. Each passage extend from or along one surface of the structured wafer and to the top surface, such that passages do not define side edges of structured wafer extending from the top surface to the one surface of the structured wafer.
Filed: 9/21/2011
Application Number: US13239181A
Tech ID: SD 11956.0
This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention.
Data from Derwent World Patents Index, provided by Clarivate
All rights reserved. Republication or redistribution of Clarivate content, including by framing or similar means, is prohibited without the prior written consent of Clarivate. Clarivate and its logo, as well as all other trademarks used herein are trademarks of their respective owners and used under license.