Heat exchanger device and method for heat removal or transfer
| DWPI Title: Heat exchanging apparatus e.g. air-bearing heat exchanger for CPU of personal computer, has heat transfer structure that is coupled to heat conducting structure to form gas filled gap region having low thermal resistance |
| Abstract: Systems and methods for a forced-convection heat exchanger are provided. In one embodiment, heat is transferred to or from a thermal load in thermal contact with a heat conducting structure, across a narrow air gap, to a rotating heat transfer structure immersed in a surrounding medium such as air. |
| Use: Heat exchanging apparatus e.g. air-bearing heat exchanger for CPU (claimed) of personal computer. Can also be used in heater, refrigerator, freezer, absorption chiller, evaporative cooler, thermal reservoir, condenser, radiator, heat pump, heat engine, motor and generator. |
| Advantage: Since the structural elements are included in mechanical reinforcement of hollow cavity defined by heat transfer structure, the mechanical deflection of exterior surface is reduced and cavity wall thickness is minimized using reinforcement structures so as to reduce thermal resistance, weight, and/or cost of the heat conducting structure. Since the gas filled gap region is provided with low thermal resistance, the energy efficiency of the exchanger is improved. |
| Novelty: The apparatus has heat conducting structure (2110) that is in thermal contact with thermal load and heat transfer structure (2105) that is immersed in surrounding medium. The heat transfer structure is coupled to heat conducting structure to form gas filled gap region sandwiched between heat conducting structure and heat transfer structure. The gas filled gap region is provided with low thermal resistance. The heat transfer structure is moved relative to heat conducting structure. The thermal load is coupled to heat conducting structure using polymer solvent weld. |
| Filed: 8/13/2010 |
| Application Number: US2010856440A |
| Tech ID: SD 10948.6 |
| This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention. |
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