Low-temperature nanosolders

DWPI Title: Nano-solders for interconnecting materials in electronic and microelectronic industries, has metal nanoparticle core that is coated with metal shell, in which first metal has higher surface energy and smaller atomic size than second metal
Abstract: A nanosolder comprises a first metal nanoparticle core coated with a second metal shell, wherein the first metal has a higher surface energy and smaller atomic size than the second metal. For example, a bimetallic nanosolder can comprise a protective Ag shell “glued” around a reactive Cu nanoparticle. As an example, a 3-D epitaxial Cu-core and Ag-shell structure was generated from a mixture of copper and silver nanoparticles in toluene at temperatures as low as 150° C.
Use: Low temperature nanosolders for interconnecting materials in electronic and microelectronic industries.
Advantage: The synthesized nanoparticles are spherical, particularly at small sizes, which is reasonable for accessing the effects of different surface energies on a final state. The nano-solder has rapid transition that minimizes the detrimental effects of long-term exposure between a molten solder and the base materials, including erosion/dissolution of the latter as well as the formation of brittle intermetallic compounds at the solder/base material interface.
Novelty: The nano-solders has first metal nanoparticle core that is coated with a second metal shell, in which the first metal has a higher surface energy and smaller atomic size than the second metal. The first metal has a surface energy that is greater than 1.25 times the surface energy of the second metal. The first metal is made up of copper and the second metal is made up of silver.
Filed: 10/5/2015
Application Number: US14875468A
Tech ID: SD 12758.2
This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention.
Data from Derwent World Patents Index, provided by Clarivate
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